High-precision 3D perception in short and medium distance
The high-sensitivity single photon avalanche diode (SPAD) array, high-precision time-to-digital converter (TDC) array，and digital signal processor (DSP) are monolithically integrated, comprising background light suppression, noise reduction, and data compression algorithms.
With a vertical cavity surface emitting laser (VCSEL) array, miniaturized modules can be implemented, based on the direct time-of-flight (dToF) technique, to achieve the mobile terminal 3D perception with miniaturization and low-power features.
Augmented reality (AR), virtual reality (VR), digital room, intelligent street view, intelligent home, etc.
Remote high-resolution 3D detection
The large scale single photon avalanche diode (SPAD）array, high precision time-to-digital converter (TDC) array, and high-speed serial interface are monolithically integrated.
With the laser diode (LD) or vertical cavity surface emitting laser (VCSEL) array, the high-resolution 3D detection can be achieved of a large field-of-view over a long distance based on the direct time-of-flight (dToF) technique and temporal/spatial statistics method, with the aid of various algorithms including background light suppression, noise reduction, and data compression, etc.
Automatic Driving, Auxiliary Driving, Confined Space Transport, Industrial Automation, etc.
Multi-linear-array 3D scanning
Multi-channel SiPM is adopted as a front-end photoelectronic sensor, which is monolithically integrated or flexibly cooperates with high speed low noise transimpedance amplifier (TIA), high precision time-to-digital converter (TDC), and high-speed ADC. Thus, the level of integration and uniformity of the front-end circuit are greatly improved, and the volume, power consumption, and cost of the rotating scanner or MEMS based LiDAR are significantly reduced.
Low cost solutions, automatic driving, safety guard, and intelligent traffic, etc.